Mainly used in the field of consumer precision electronics, including processes such as dust-catching gluing, prism gluing, Holder Bond, Lens shading gluing, enameled wire welding for VCM and solder joint protection gluing in the CCM field, Tuffy gluing in the screen display field, MiniLED Chip Coating, Underfill in the SMT field, Component Coating, 3D mobile phone middle bezel dispensing in the FATP field and VR/AR middle bezel dispensing
FATP: Smartphone, Smart Watch, XR/VR
SMT: PCB Component, FPC Component
Optical Component: CCM, LENS
Screen Display: OLED、LCM、MiniLED、TFT-LCD、Micro-LED
Precision Motor: Linear Motor, Voice Coil Motor
Discrete Component: MEMS Microphone, MEMS Barometer, Optical Communication Device
CCM: Dust-catch Glue, Lens Glue, Holder Bond, Lens Light-blocking Adhesive
VCM: Enamel Wire Soldering & Solder Joint Protection Adhesive
Screen Display: Tuffy Glue、MiniLED Chip Coating
SMT: Chip Underfill、Component Coating
FATP: 3D Phone Mid-frame Dispensing、VR/AR Mid-frame Dispensing
In the era of ever-smaller, higher-performance, and longer-lasting smartphones, ultrathin laptops, and wearable devices, the miniaturization and integration of internal components have become key trends. Advanced materials such as ceramics, silicon carbide, diamond, carbon fiber composites, and titanium alloys—characterized by high strength, hardness, and brittleness—are widely applied, placing stringent demands on machining precision and quality. Water jet guided laser processing technology, with its unique composite capabilities, effectively suppresses micro-cracks, thermal damage, and edge chipping, enabling breakthroughs in precision manufacturing for consumer electronics while ensuring the reliability and stability of high-performance components.
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Typical Materials |
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Carbon-based Diamond
Copper-based Diamond
Boron Nitride
Alumina Ceramic
